Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive components

ABSTRACT

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.15/807,110, entitled “PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVECOMPONENTS AND METHODS FOR PROTECTING THERMALLY SENSITIVE COMPONENTS”and filed on Nov. 8, 2017, which claims the benefit of, and priority to,U.S. Provisional Patent Application No. 62/418,879, entitled “3D PRINTEDPROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS” and filed onNov. 8, 2016, the entire contents of which are hereby incorporatedherein by reference.

TECHNICAL FIELD

The present disclosure relates to Printed Circuit Board Assemblies(PCBAs) and, more specifically, to protective heat shields and methodsfor protecting thermally sensitive components during manufacture ofPCBAs.

BACKGROUND

The process flow for manufacturing PCBAs including surface mounttechnology (SMT) components includes, among other steps, screen printingof solder paste, component pick and place, and reflow, wherein thecircuit board being manufactured is passed through a reflow oven (orother suitable heating device) and exposed to high temperatures in orderto melt the solder paste and permanently connect the SMT components tothe circuit board.

The process flow for manufacturing PCBAs including pin-through-hole(PTH) components includes, among other steps, PTH component placementand wave soldering, wherein the circuit board being manufactured ispassed through a wave soldering machine that exposes the underside ofthe circuit board to an upwelling of molten solder to permanentlyconnect the PTH components to the circuit board. When passing throughthe wave solder machine, the circuit board is exposed to hightemperatures.

The high temperature environments that the circuit board encountersduring the reflow and/or wave soldering processes may includetemperatures that rise above the maximum allowable temperatures ofthermally sensitive components of the circuit board, potentiallyresulting in failure of these thermally sensitive components.

It would therefore be desirable to protect thermally sensitivecomponents during reflow, wave soldering, and/or other high-temperatureprocesses. It would be further advantageous to do so while minimizingcosts and waste, without interfering with the assembly process, andwithout damaging or contaminating the PCBA.

SUMMARY

The present disclosure provides protective heat shields and methods thatprotect thermally sensitive components during reflow, wave soldering,and/or other high-temperature processes. The protective heat shields andmethods of the present disclosure are also cost-effective and reusable,do not interfere with the assembly process, and avoid damaging orcontaminating the PCBA. These and other aspects and features of thepresent disclosure are detailed below. To the extent consistent, any ofthe aspects and features described herein may be used in conjunctionwith any or all of the other aspects and features described herein.

Provided in accordance with the present disclosure is a method ofmanufacturing a printed circuit board assembly. The method includesproviding a circuit board and positioning a plurality of components onthe circuit board. At least one of the components is athermally-sensitive component having a maximum temperature threshold.The method further includes positioning a customized protective heatshield on the thermally-sensitive component, exposing the circuit board(having the thermally-sensitive component disposed thereon and thecustomized protective heat shield disposed on the thermally-sensitivecomponent) to a high-temperature environment wherein temperatures exceedthe maximum temperature threshold of the thermally-sensitive component,and removing the customized protective heat shield from thethermally-sensitive component.

In an aspect of the present disclosure, the customized protective heatshield is positioned on the thermally-sensitive component prior topositioning of the thermally-sensitive component on the circuit board.In such aspects, the thermally-sensitive component and the customizedprotective heat shield may together be picked and placed on the circuitboard with a surface mount technology machine.

In another aspect of the present disclosure, the customized protectiveheat shield is positioned on the thermally-sensitive component afterpositioning of the thermally-sensitive component on the circuit board.

In still another aspect of the present disclosure, positioning thecustomized protective heat shield on the thermally-sensitive componentincludes engaging the customized protective heat shield with thethermally-sensitive component.

In yet another aspect of the present disclosure, positioning thecustomized protective heat shield on the thermally-sensitive componentincludes receiving a connector of the thermally-sensitive componentwithin an opening defined within the customized protective heat shield.

In still yet another aspect of the present disclosure, the customizedprotective heat shield is 3D printed and formed of a high temperaturegrade plastic.

In another aspect of the present disclosure, the customized protectiveheat shield is shaped complementary to at least a portion of thethermally-sensitive component.

In yet another aspect of the present disclosure, exposing the circuitboard to a high temperature environment includes passing the circuitboard through a reflow machine and/or passing the circuit board througha wave solder machine.

Another method of manufacturing a printed circuit board assemblyprovided in accordance with the present disclosure includes determininga configuration of a thermally-sensitive component, determining a layoutof a circuit board upon which the thermally-sensitive component is to bepositioned, creating a digital model file of a customized protectiveheat shield for the thermally-sensitive component based on theconfiguration of the thermally-sensitive component and the layout of thecircuit board, 3D printing the customized protective heat shield fromthe digital model file, and assembling a first printed circuit boardassembly. Assembling the first printed circuit board assembly includespositioning the thermally-sensitive component on the circuit board,positioning the customized protective heat shield on thethermally-sensitive component, exposing the circuit board (having thethermally-sensitive component disposed thereon and the customizedprotective heat shield disposed on the thermally-sensitive component) toa high-temperature environment, and removing the customized protectiveheat shield from the thermally-sensitive component.

In an aspect of the present disclosure, the method further includesassembling a second printed circuit board assembly reusing thecustomized protective heat shield.

In another aspect of the present disclosure, the customized protectiveheat shield is positioned on the thermally-sensitive component prior topositioning of the thermally-sensitive component on the circuit board.Alternatively, the customized protective heat shield is positioned onthe thermally-sensitive component after positioning of thethermally-sensitive component on the circuit board.

In still another aspect of the present disclosure, determining theconfiguration of the thermally-sensitive component includes at least oneof: determining a shape of the thermally-sensitive component,determining a position of a connector of the thermally-sensitivecomponent, or determining a portion of the thermally-sensitive componentcapable of being engaged by the customized protective heat shield.

In yet another aspect of the present disclosure, 3D printing thecustomized protective heat shield from the digital model file includesat least one of: forming the customized protective heat shield to becomplementary to at least a portion of the thermally-sensitivecomponent, defining an opening in the customized protective heat shieldto receive a connector of the thermally-sensitive component, orproviding the customized protective heat shield with an engagementfeature to engage the thermally-sensitive component.

In still yet another aspect of the present disclosure, the customizedprotective heat shield is 3D printed from a high temperature gradeplastic.

An assembly during manufacture of a printed circuit board assemblyprovided in accordance with the present disclosure includes a circuitboard, a plurality of components on the circuit board, and a customizedprotective heat shield. At least one of the components is athermally-sensitive component having a maximum temperature threshold.The customized protective heat shield is removably disposed on thethermally-sensitive component, surrounds at least a portion of thethermally-sensitive component, and is shaped complementary to at least aportion of the thermally-sensitive component. The customized protectiveheat shield is configured to thermally insulate the thermally-sensitivecomponent from a high-temperature environment having temperatures abovethe maximum temperature threshold such that a temperature of thethermally-sensitive component is maintained below the maximumtemperature threshold.

In an aspect of the present disclosure, the customized protective heatshield is 3D printed and formed of a high temperature grade plastic.

In another aspect of the present disclosure, the customized protectiveheat shield includes an engagement finger configured to engage a portionof the thermally-sensitive component.

In another aspect of the present disclosure, the customized protectiveheat shield defines an opening configured to receive a connector of thethermally-sensitive component.

BRIEF DESCRIPTION OF THE DRAWINGS

Various aspects and features of the present disclosure are describedhereinbelow with reference to the drawings wherein like numeralsdesignate similar elements in each of the several views and:

FIG. 1A is a perspective view of an exemplary PCBA including thermallysensitive components;

FIG. 1B is an exploded, perspective view illustrating the PCBA of FIG.1A and protective heat shields for use therewith to protect thethermally sensitive components thereof;

FIG. 2 is an enlarged, exploded, perspective view of a portion of thePCBA of FIG. 1A illustrating a first protective heat shield for use witha first thermally sensitive component of the PCBA;

FIG. 3 is an enlarged, exploded, perspective view of a portion of thePCBA of FIG. 1A illustrating a second protective heat shield for usewith a second thermally sensitive component of the PCBA;

FIG. 4A is an enlarged, exploded, perspective view of a portion of thePCBA of FIG. 1A illustrating a third protective heat shield for use witha third thermally sensitive component of the PCBA;

FIG. 4B is an enlarged, perspective view of the portion of the PCBA ofFIG. 1A illustrated in FIG. 4A, wherein the third protective heat shieldis engaged with the third thermally sensitive component; and

FIG. 5 is a schematic drawing of a portion of an assembly lineillustrating a portion of a PCBA manufacturing process flow.

DETAILED DESCRIPTION

Turning to FIGS. 1A and 1B, a Printed Circuit Board Assembly (PCBA) isshown generally identified by reference numeral 10. PCBA 10 generallyincludes a circuit board 12 and a plurality of components 14 operablydisposed on circuit board 12. Some or all of the components 14 may beSurface Mount Technology (SMT) components engaged on circuit board 12via an SMT process. Alternative or additionally, some or all of thecomponents 14 may be Pin-Through-Hole (PTH) components engaged oncircuit board 12 via a PTH process. At least some of the components 14are thermally-sensitive components 16 a, 16 b, 16 c, components that mayfail when exposed to high temperatures, e.g., temperatures exceeding250° C. or other temperature threshold. Such thermally-sensitivecomponents include, but are not limited to, e.g., capacitors, fuses,inductors and transformers with wire coils, non-solid state relays,LED's, and Surface Mount Technology (SMT) connectors. Although oneconfiguration of a PCBA 10 is shown in FIGS. 1A and 1B, it is understoodthat the aspects and features of the present disclosure apply equally toany PCBA including one or more thermally-sensitive components.

Continuing with reference to FIGS. 1A and 1B, as can be appreciated,thermally-sensitive components 16 a, 16 b, 16 c may define variousdifferent configurations and surroundings, depending upon the particularcomponent, its position on circuit board 12 relative to the othercomponents 14, the method by which it is engaged on circuit board 12,e.g., an SMT process or a PTH process, and/or other factors. Forexample, a first thermally-sensitive component 16 a may define arelatively tall, relatively small-diametered cylindrical configuration;a second thermally-sensitive component 16 b may define a relativelyshort, relatively large-diametered cylindrical configuration including abase platform upon which the cylinder is disposed; and a thirdthermally-sensitive component 16 c may define a ring-shapedconfiguration. As detailed below, protective heat shields 20, 30, 40(FIG. 1B) provided in accordance with the present disclosure arecustomized to one or more thermally-sensitive components 16 a, 16 b, 16c, respectively, and the surroundings thereof to enable protective heatshields 20, 30, 40 to protect, e.g., thermally insulate,thermally-sensitive components 16 a, 16 b, 16 c, respectively, duringhigh-temperature manufacturing steps, e.g., reflow and/or wavesoldering.

Although various features of protective heat shields 20, 30, 40 aredetailed below with respect to a particular protective heat shield 20,30, 40, it is understood that any suitable heat shield having anysuitable combination of features may be provided, depending upon aparticular purpose. Further, although protective heat shields 20, 30, 40are detailed herein as corresponding to thermally-sensitive components16 a, 16 b, 16 c, respectively, it is also contemplated that aprotective heat shield may correspond to two-or more thermally-sensitiveor other components, such as, for example, where multiplethermally-sensitive components are in close proximity, where thelocation of the thermally-sensitive components or other componentsnecessitates use of a common protective heat shield, and/or in otherinstances.

Referring to FIG. 2, in conjunction with FIGS. 1A and 1B, in order toprotect first thermally-sensitive component 16 a, first protective heatshield 20 is provided. First protective heat shield 20 is manufacturedvia 3D printing, which enables first protective heat shield 20 to becustomized to first thermally-sensitive component 16 a and thesurroundings thereof without the need for tooling or othercomponent-specific manufacturing equipment. First protective heat shield20, more specifically, may be 3D printed from a digital model filedesigned based upon the configuration of first thermally-sensitivecomponent 16 a, the surroundings thereof, and the desired propertiesand/or features of first protective heat shield 20. As can beappreciated, by 3D printing first protective heat shield 20, complexgeometries and/or configurations may be provided, thus enabling firstprotective heat shield 20 to be configured for almost anythermally-sensitive component(s), board configurations, features, and/orproperties. First protective heat shield 20, for example, may be formedfrom a relatively light weight, high-temperature grade 3D printingmaterial, e.g., a high-temperature grade plastic, and may define aconfiguration complementary to first thermally-sensitive component 16 a,e.g., a relatively tall, relatively small-diametered cylindricalconfiguration, such that first protective heat shield 20 can encompassfirst thermally-sensitive component 16 a therein without interferingwith surrounding components.

First protective heat shield 20 may further include a pick-up area 22enabling first protective heat shield 20 to be picked and placed by anSMT machine during manufacture of PCBA 10. First protective heat shield20 may be picked and placed together with first thermally-sensitivecomponent 16 a or separately therefrom. First protective heat shield 20may alternatively be positioned on first thermally-sensitive component16 a in any other suitable manner, and/or first thermally-sensitivecomponent 16 a may be a PTH component or other suitable component.

Referring to FIG. 3, in conjunction with FIGS. 1A and 1B, in order toprotect second thermally-sensitive component 16 b, second protectiveheat shield 30 is provided. Second protective heat shield 30 ismanufactured via 3D printing, which enables second protective heatshield 30 to be customized to second thermally-sensitive component 16 band the surroundings thereof without the need for tooling or othercomponent-specific manufacturing equipment, similarly as detailed abovewith respect to first protective heat shield 20 (FIG. 2). Secondprotective heat shield 30, for example, may be formed from a relativelylight weight, high-temperature grade 3D printing material, e.g., ahigh-temperature grade plastic, and may define a configurationcomplementary to second thermally-sensitive component 16 b, e.g., arelatively short, relatively large-diametered cylindrical configurationincluding a base platform upon which the cylinder is disposed, such thatsecond protective heat shield 30 can encompass secondthermally-sensitive component 16 b therein without interfering withsurrounding components or connections.

Second protective heat shield 30 may further include a pick-up area 32,similarly as detailed above with respect to first protective heat shield20 (FIG. 2). Second protective heat shield 30 may additionally oralternatively define one or more cut-outs 34 configured to receive oneor more connections 18 (or other features) associated with secondthermally-sensitive component 16 b such that the connections 18 (orother features) are not damaged upon placement of second protective heatshield 30 about second thermally-sensitive component 16 b.

Referring to FIGS. 4A and 4B, in conjunction with FIGS. 1A and 1B, inorder to protect third thermally-sensitive component 16 c, thirdprotective heat shield 40 is provided. Third protective heat shield 40is manufactured via 3D printing, which enables third protective heatshield 40 to be customized to third thermally-sensitive component 16 cand the surroundings thereof without the need for tooling or othercomponent-specific manufacturing equipment, similarly as detailed abovewith respect to first protective heat shield 20 (FIG. 2). Thirdprotective heat shield 40, for example, may be formed from a relativelylight weight, high-temperature grade 3D printing material, e.g., ahigh-temperature grade plastic, and may define a configurationcomplementary to a portion of third thermally-sensitive component 16 c,e.g., defining a semi-disc-shaped configuration, such that thirdprotective heat shield 40 can encompass a portion of thirdthermally-sensitive component 16 c therein without interfering withsurrounding components or connections.

Third protective heat shield 40, as detailed above and as illustrated inFIGS. 4A and 4B, is configured to cover only a portion of thirdthermally-sensitive component 16 c. In certain instances, such as withrespect to third protective heat shield 40 and third thermally-sensitivecomponent 16 c, the protective heat shield need not fully surround thethermally-sensitive component(s) in order to protect, e.g., thermallyinsulate, the thermally-sensitive component(s) from high temperatureenvironments.

Third protective heat shield 40 may further include a pick-up area 42,similarly as detailed above with respect to first protective heat shield20 (FIG. 2). Third protective heat shield 40 may additionally oralternatively include one or more engagement fingers 46, each configuredto engage a corresponding opening 19, e.g., slot, aperture, recess,other opening, etc., defined within third thermally-sensitive component16 c such that the third protective heat shield 40 may be releasablyengaged with third thermally-sensitive component 16 c. The one or moreengagement fingers 46 may be in the form of a tab, hook, protrusion, orother suitable structure capable of releasably engaging thecorresponding opening(s) 19 of third thermally-sensitive component 16 cto maintain third protective heat shield 40 in position about thirdthermally-sensitive component 16 c.

Referring generally to FIGS. 1A and 1B, as demonstrated above, variousdifferent configurations of protective heat shields 20, 30, 40 may beprovided. However, the present disclosure is not limited to thoseconfigurations of protective heat shields 20, 30, 40 detailed above.Rather, protective heat shields 20, 30, 40 are merely examples ofprotective heat shields capable of being manufactured via 3D printing.Of course, any suitable customized protective heat shield based uponparticular thermally-sensitive component(s), board configuration,feature(s), and/or property(s) can be manufactured via 3D printing asneeded. Thus, at the design stage of a manufacturing project, once theparticular thermally-sensitive and other components to be utilized aredetermined, and one the layout of the circuit board is determined,digital model files (e.g., created on a general purpose computer withsuitable CAD software) of appropriate protective heat shield(s) can becustomized to the thermally-sensitive component(s) and board layout.More specifically, as demonstrated in the above-exemplary embodiments,each protective heat shield can be designed complementary to at least aportion of the thermally-sensitive component(s) it is to protect, can bedesigned with features to inhibit damage to connectors of thethermally-sensitive component(s) and surrounding components, can bedesigned with features to enable the protective heat shield to engagethe thermally-sensitive component(s), can be designed to enablepositioning about the thermally-sensitive component(s) withoutinterfering with surrounding components, can be designed to includefeatures facilitating pick and placement thereof, and can be designed toinclude any other desired feature(s) and/or property(s), thus enabling3D printing of protective heat shields that meet the exact needs of theparticular manufacturing project.

In addition, various different materials may be utilized for 3D printingor otherwise incorporated into the resultant protective heat shield toachieve a desired property throughout or on certain portions of theprotective heat shield. For example, conductive material may beincorporated into the protective heat shield to make the protective heatshield at least partially conductive; reinforcing material may beincorporated into the protective heat shield to make the protective heatshield stronger in certain areas; higher heat-resistant material may beincorporated into the protective heat shield to increase the thermalprotection of the protective heat shield in certain areas; etc.

Turning now to FIG. 5, in conjunction with FIGS. 1A and 1B, a portion ofan assembly line 100 for the manufacture of PCBAs, e.g., PCBA 10, isillustrated. Assembly line 100 includes a board loading station 110, asolder screen printing station 120, a solder paste inspection station130, a pick and place station 140, an automatic optical inspectionstation 150, a reflow station 160, and a plurality of additionalstations 170 (only one of which is illustrated). At the board loadingstation 110, the circuit board 12 is loaded on the assembly line 100. Atthe solder screen printing station 120, solder paste is applied, and atthe solder paste inspection station 130, the solder paste is inspected.

At the pick and place station 140, the components 14 that are SMTcomponents are positioned on the circuit board 12 via an SMT machine. Atthe pick and place station 140, the thermally-sensitive components 16 a,16 b, 16 c may already include the respective protective heat shields20, 30, 40 engaged thereon such that the thermally-sensitive componentand protective heat shield pairs 16 a and 20, 16 b and 30, 16 c and 40,are together moved into position on the circuit board 12 via the SMTmachine at the pick and place station 140. Alternatively, the pick andplace station 140 may include separate machinery, or may be configuredsuch that the SMT machine operates sequentially to first load thecomponents 14 that are SMT components onto the circuit board 12, andthereafter engage the protective heat shields 20, 30, 40 on thethermally-sensitive components 16 a, 16 b, 16 c, respectively. Asanother alternative, a separate station may be provided for positioningthe protective heat shields 20, 30, 40 on the thermally-sensitivecomponents 16 a, 16 b, 16 c.

At the automatic optical inspection station 150, the PCBA 10 is scannedfor failures and defects. At the reflow station 160, the PCBA 10 entersa reflow oven (or other suitable heating device) and is exposed to hightemperatures in order to melt the solder paste and permanently connectthe components 14 that are SMT components to the circuit board 12.Protective heat shields 20, 30, 40, disposed on the correspondingthermally-sensitive components 16 a, 16 b, 16 c protect these components16 a, 16 b, 16 c from the high temperature environment of the reflowoven, thus preventing failure of these components 16 a, 16 b, 16 c.

Once the PCBA 10 exits the reflow station 160, the assembly line 100proceeds to the plurality of additional stations 170. If no furtherhigh-temperature environments are encountered, one of the plurality ofadditional stations 170 may include removing the protective heat shields20, 30, 40. Alternatively, if further high-temperature environments areencountered, such as within a wave solder machine, the protective heatshields 20, 30, 40 are left in position until the PCBA 10 completes thestations where high-temperature environments are encountered.

The plurality of additional stations 170 may include, for example, a PTHplacement station and a wave solder station (or assembly line 100 mayinclude a PTH placement station and a wave solder station in place ofthe SMT pick and place and reflow stations detailed above). In suchconfigurations, protective heat shields may be placed ontemperature-sensitive PTH components before placement on the circuitboard 12 such that the temperature-sensitive PTH components and theirprotective heat shields are together placed on the circuit board 12, ormay be placed on the temperature-sensitive PTH components after thetemperature-sensitive PTH components have already been positioned on thecircuit board 12. Similarly as above, the protective heat shields areremoved once the PCBA 10 completes all the stations wherehigh-temperature environments are encountered.

Since the protective heat shields are removed prior to completion ofmanufacturing, contamination of the PBCA is avoided. Once removed, theprotective heat shields may be reused in the manufacture of subsequentPCBAs, similarly as detailed above.

Persons skilled in the art will understand that the structures andmethods specifically described herein and shown in the accompanyingfigures are non-limiting exemplary embodiments, and that thedescription, disclosure, and figures should be construed merely asexemplary of particular embodiments. It is to be understood, therefore,that the present disclosure is not limited to the precise embodimentsdescribed, and that various other changes and modifications may beaffected by one skilled in the art without departing from the scope orspirit of the disclosure. Additionally, the elements and features shownor described in connection with certain embodiments may be combined withthe elements and features of certain other embodiments without departingfrom the scope of the present disclosure, and that such modificationsand variations are also included within the scope of the presentdisclosure. Accordingly, the subject matter of the present disclosure isnot limited by what has been particularly shown and described.

What is claimed is:
 1. A method of manufacturing a printed circuit boardassembly, the method comprising: providing a circuit board; positioninga plurality of components on the circuit board, at least one of thecomponents being a thermally-sensitive component having a maximumtemperature threshold; positioning a customized protective heat shieldon the thermally-sensitive component; exposing the circuit board to ahigh-temperature environment wherein temperatures exceed the maximumtemperature threshold of the thermally-sensitive component; and removingthe customized protective heat shield from the thermally-sensitivecomponent.
 2. The method according to claim 1, wherein the customizedprotective heat shield is positioned on the thermally-sensitivecomponent prior to positioning of the thermally-sensitive component onthe circuit board.
 3. The method according to claim 2, wherein thethermally-sensitive component and the customized protective heat shieldare together picked and placed on the circuit board with a surface mounttechnology machine.
 4. The method according to claim 1, wherein thecustomized protective heat shield is positioned on thethermally-sensitive component after positioning of thethermally-sensitive component on the circuit board.
 5. The methodaccording to claim 1, wherein positioning the customized protective heatshield on the thermally-sensitive component includes engaging thecustomized protective heat shield with the thermally-sensitivecomponent.
 6. The method according to claim 1, wherein positioning thecustomized protective heat shield on the thermally-sensitive componentincludes receiving a connector of the thermally-sensitive componentwithin an opening defined within the customized protective heat shield.7. The method according to claim 1, wherein the customized protectiveheat shield is 3D printed and formed of a high temperature gradeplastic.
 8. The method according to claim 1, wherein the customizedprotective heat shield is shaped complementary to at least a portion ofthe thermally-sensitive component.
 9. The method according to claim 1,wherein exposing the circuit board to a high temperature environmentincludes at least one of: passing the circuit board through a reflowmachine or passing the circuit board through a wave solder machine. 10.A method of manufacturing a printed circuit board assembly, the methodcomprising: determining a configuration of a thermally-sensitivecomponent; determining a layout of a circuit board upon which thethermally-sensitive component is to be positioned; creating a digitalmodel file of a customized protective heat shield for thethermally-sensitive component based on the configuration of thethermally-sensitive component and the layout of the circuit board; 3Dprinting the customized protective heat shield from the digital modelfile; and assembling a first printed circuit board assembly, whereinassembling the first printed circuit board assembly includes:positioning the thermally-sensitive component on the circuit board;positioning the customized protective heat shield on thethermally-sensitive component; exposing the circuit board to ahigh-temperature environment; and removing the customized protectiveheat shield from the thermally-sensitive component.
 11. The methodaccording to claim 10, further comprising: assembling a second printedcircuit board assembly, wherein the customized protective heat shield isreused during assembly of the second printed circuit board assembly. 12.The method according to claim 10, wherein the customized protective heatshield is positioned on the thermally-sensitive component prior topositioning of the thermally-sensitive component on the circuit board.13. The method according to claim 10, wherein the customized protectiveheat shield is positioned on the thermally-sensitive component afterpositioning of the thermally-sensitive component on the circuit board.14. The method according to claim 10, wherein determining theconfiguration of the thermally-sensitive component includes at least oneof: determining a shape of the thermally-sensitive component,determining a position of a connector of the thermally-sensitivecomponent, or determining a portion of the thermally-sensitive componentcapable of being engaged by the customized protective heat shield. 15.The method according to claim 10, wherein 3D printing the customizedprotective heat shield from the digital model file includes at least oneof: forming the customized protective heat shield to be complementary toat least a portion of the thermally-sensitive component, defining anopening in the customized protective heat shield to receive a connectorof the thermally-sensitive component, or providing the customizedprotective heat shield with an engagement feature to engage thethermally-sensitive component.
 16. The method according to claim 10, thecustomized protective heat shield is 3D printed from a high temperaturegrade plastic.